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For the Inventor, By the Inventor

Gunpo-si, South Korea

Dae-youp Lee

USPTO Granted Patents = 12

Average Co-Inventor Count = 3.1

ph-index = 4

Forward Citations = 69(Granted Patents)


Location History:

  • Kunpo, KR (2003)
  • Gunpo, KR (2004)
  • Kyungki-do, KR (2005)
  • Gunpo-si, KR (2003 - 2013)
  • Gyeonggi-do, KR (2006 - 2013)

Company Filing History:

goldMedal12 out of 131,214 
 
Samsung Electronics Co., Ltd.
 patents

Years Active: 2003-2013

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12 patents (USPTO):Explore Patents
1. 8546258 - Method of fabricating metal contact using double patterning technology and device formed thereby (2013-10-01),
2. 8384876 - Method of detecting reticle errors (2013-02-26),
3. 8361905 - Methods of forming patterns for semiconductor devices (2013-01-29),
4. 8241820 - Photomask used in fabrication of semiconductor device (2012-08-14),
5. 8227354 - Method of forming semiconductor device patterns (2012-07-24),
6. 7083899 - Method for manufacturing a semiconductor device (2006-08-01),
7. 6933247 - Method for forming a minute pattern and method for manufacturing a semiconductor device using the same (2005-08-23),
8. 6841338 - Photoresist composition and method of forming a photoresist pattern with a controlled remnant ratio (2005-01-11),
9. 6818480 - Method of forming a pattern of a semiconductor device and photomask therefor (2004-11-16),
10. 6673706 - Method of forming a pattern using a photoresist without exposing the photoresist and silicidation method incorporating the same (2004-01-06),
11. 6620690 - Method of fabricating flash memory device using self-aligned non-exposure pattern formation process (2003-09-16),
12. 6571384 - Method of forming fine patterns on semiconductor device (2003-05-27),

Title: Innovations of Dae-youp Lee

Introduction

Dae-youp Lee is a prominent inventor based in Gunpo-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 12 patents. His work focuses on improving manufacturing processes and enhancing the performance of semiconductor devices.

Latest Patents

One of Dae-youp Lee's latest patents is a method of fabricating metal contacts using double patterning technology. This innovative process allows for the reduction of a string overhead area, which in turn decreases the chip size of semiconductor devices. The method involves forming a first mask pattern by etching a first mask layer, which includes openings in both the cell and peripheral regions. Additionally, he has developed a method of detecting reticle errors, which utilizes an optical source to detect errors at a wafer level by analyzing changes in a photoresist film.

Career Highlights

Dae-youp Lee is currently employed at Samsung Electronics Co., Ltd., where he continues to push the boundaries of semiconductor technology. His expertise and innovative approaches have made him a valuable asset to the company and the industry as a whole.

Collaborations

Some of Dae-youp Lee's notable coworkers include Bong-cheol Kim and Jeung-woo Lee. Their collaborative efforts contribute to the advancement of technology within their field.

Conclusion

Dae-youp Lee's contributions to semiconductor technology through his patents and work at Samsung Electronics Co., Ltd. highlight his role as a leading inventor in the industry. His innovative methods are paving the way for future advancements in semiconductor manufacturing.

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