Phoenix, AZ, United States of America

Dae-Woo Kim

This inventor holds 21 USPTO granted patents and 4 published patent applications, primarily in Semiconductor Packaging. Top assignee: Intel Corporation. Active years: 2017-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dae-Woo Kim. Retrieved from https://idiyas.com/inventor/dae-woo-kim

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 21 

% Patents Active = 95.2

Average Co-Inventor Count = 3.1

ph-index = 4

Forward Citations = 62(Granted Patents)


Company Filing History:


Years Active: 2017-2025

Loading Chart...
Areas of Expertise:
Silicon Bridges
Conductive Pad Layers
Guard Ring Design
Metal-Free Frame
Stress Reduction
High Bandwidth Memory
Interconnect Routing
EMIB Copper Layer
Rounded Metal Trace
Projecting Contacts
In-Line Testing
Die Stepping Sort
21 patents (USPTO):Explore Patents

Title: Innovations and Contributions of Dae-Woo Kim in Semiconductor Technology

Introduction

Dae-Woo Kim is a prominent inventor located in Phoenix, AZ, recognized for his significant contributions to semiconductor technology. With a remarkable portfolio of 21 patents, he has been instrumental in advancing the field through innovative designs and solutions.

Latest Patents

Dae-Woo Kim's latest patents include groundbreaking work on "Alternative surfaces for conductive pad layers of silicon bridges for semiconductor packages." This patent describes a semiconductor structure that features a substrate with a lower insulating layer and a sophisticated metallization structure that integrates conductive routing and multiple conductive pads. This design aims to enhance the efficiency and functionality of semiconductor packages.

Another notable patent is focused on "Metal-free frame designs for silicon bridges for semiconductor packages." This invention describes a semiconductor structure where a substrate is equipped with an insulating layer and a metallization structure that incorporates guard rings and a surrounding metal-free region. This innovative design is poised to improve the performance and manufacture of silicon bridges in semiconductor technology.

Career Highlights

Dae-Woo Kim currently works at Intel Corporation, a leading company in semiconductor manufacturing and technology. His expertise and dedication have led to numerous advancements in semiconductor structures, solidifying his reputation as a leading figure in the industry.

Collaborations

Throughout his career, Dae-Woo Kim has collaborated with esteemed colleagues such as Sujit Sharan and Sairam Agraharam. These collaborations have fostered a productive environment for innovation, further enhancing the development of cutting-edge semiconductor technologies.

Conclusion

Dae-Woo Kim's contributions to the field of semiconductor technology are both impactful and transformative. His continued work in developing patents and innovative designs at Intel Corporation underscores his role as a key player in advancing semiconductor solutions, paving the way for future innovations in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…