The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 13, 2021
Filed:
Dec. 22, 2015
Intel Corporation, Santa Clara, CA (US);
Dae-Woo Kim, Phoenix, AZ (US);
Sujit Sharan, Chandler, AZ (US);
Ravindranath V. Mahajan, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A package assembly includes a substrate extending from a first substrate end to a second substrate end. A plurality of conductive traces extend along the substrate. A plurality of contacts are coupled with the respective conductive traces of the plurality of conductive traces. Each of the contacts of the plurality of contacts includes a contact pad coupled with a respective conductive trace of the plurality of conductive traces, and a contact post coupled with the contact pad, the contact post extends from the contact pad. A package cover layer is coupled over the plurality of contact posts. The plurality of contact posts are configured to penetrate the package cover layer and extend to a raised location above the package cover layer.