Company Filing History:
4 out of 7,087 
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1 out of 353 Years Active: 2001-2020
Title: The Innovative Journey of Inventor Chun-Liang Liu
Introduction
Chun-Liang Liu, an accomplished inventor based in Hsinchu, Taiwan, has made significant contributions to the field of technology through his six patents. His innovative approach to problem-solving in materials and processes has led to the development of advanced methods in wafer polishing and planarization.
Latest Patents
Among his noteworthy inventions, Chun-Liang Liu's latest patents include a novel planarization method. This method involves several steps: providing a substrate with a main surface, forming a protruding structure on this surface, and subsequently covering it with an insulating layer. A stop layer is then created to cover the top surface of the protruding structure, followed by blanket formation of a first dielectric layer. The process culminates in a chemical mechanical polishing procedure that helps expose the stop layer, resulting in a defined upper surface.
His second significant patent is related to a wafer polishing pad. This polishing pad features a polishing material layer with numerous recesses on its top surface. Importantly, it incorporates a warning element within the polishing material, which changes visibility to signal when the pad needs replacement. This innovation enhances user convenience and boosts manufacturing efficiency by allowing for easy verification of the pad's condition.
Career Highlights
Chun-Liang Liu’s professional journey includes pivotal roles at prominent companies such as United Microelectronics Corporation and United Silicon Incorporated. His experience in these organizations has bolstered his expertise in both practical applications and theoretical advancements in his field.
Collaborations
Throughout his career, Liu has collaborated with talented individuals, including Hsien-Liang Meng and Po-Cheng Huang. These collaborations have played a crucial role in enriching his innovative endeavors and expanding his horizons in technology development.
Conclusion
Chun-Liang Liu’s inventive spirit and commitment to innovation continue to leave a mark in the technological landscape. With his unique contributions through patents and collaborative efforts, he is poised to inspire future advancements, making him a remarkable figure in the realm of invention. His work exemplifies how targeted innovation can enhance efficiency and safety in technology applications.