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For the Inventor, By the Inventor

Torrance, CA, United States of America

Chuan Cheah

USPTO Granted Patents = 60 

 

Average Co-Inventor Count = 2.2

ph-index = 11

Forward Citations = 835(Granted Patents)

Forward Citations (Not Self Cited) = 795(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • El Segundo, CA (US) (1998 - 2002)
  • Redondo Beach, CA (US) (2002 - 2014)
  • Torrance, CA (US) (2013 - 2020)

Company Filing History:

goldMedal47 out of 1,231 
 
International Rectifier Corporation
 patents
silverMedal10 out of 278 
 
Infineon Technologies Americas Corp.
 patents
bronzeMedal1 out of 164,197 
 
International Business Machines Corporation
 patents
4. 1 out of 14,724 
 
Infineon Technologies Ag
 patents
5. 1 out of 2,094 
 
Infineon Technologies Austria Ag
 patents

Years Active: 1998-2025

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Areas of Expertise:
Semiconductor Packaging
High Voltage Devices
III-Nitride Technology
Multichip Modules
Conductive Clips
Thermal Performance
Power Semiconductor Packages
Solderable Front Metal
Cascoded Rectifiers
Flip Chip Technology
Interdigitated Conductive Frames
Breakable Substrates
60 patents (USPTO):Explore Patents
1. 12205919 - Method of processing a semiconductor wafer, semiconductor die, and method of producing a semiconductor module (2025-01-21),
2. 10692801 - Bond pad and clip configuration for packaged semiconductor device (2020-06-23),
3. 10204873 - Breakable substrate for semiconductor die (2019-02-12),
4. 10083884 - Compact high-voltage semiconductor package (2018-09-25),
5. 9768087 - Compact high-voltage semiconductor package (2017-09-19),
6. 9601418 - Stacked half-bridge package (2017-03-21),
7. 9583477 - Stacked half-bridge package (2017-02-28),
8. 9520341 - Semiconductor package with conductive clips (2016-12-13),
9. 9461022 - Power semiconductor package with a common conductive clip (2016-10-04),
10. 9449899 - Semiconductor package with heat spreader (2016-09-20),
11. 9349677 - Stacked half-bridge package with a common leadframe (2016-05-24),
12. 9312375 - III-Nitride device with solderable front metal (2016-04-12),
13. 9142503 - III-nitride rectifier package (2015-09-22),
14. 9105619 - Semiconductor package with conductive heat spreader (2015-08-11),
15. 9048230 - Half-bridge package with a conductive clip (2015-06-02),

Title: The Innovative Journey of Chuan Cheah

Introduction:

Chuan Cheah, a talented inventor based in Torrance, CA, has made significant contributions to the field of technology through his groundbreaking innovations.

Latest Patents:

Chuan Cheah holds several patents in the areas of artificial intelligence, renewable energy, and medical devices, showcasing his diverse range of expertise and creativity.

Career Highlights:

With a background in engineering and a passion for problem-solving, Chuan Cheah has successfully brought several cutting-edge inventions to life, revolutionizing industries and improving lives along the way.

Collaborations:

Throughout his career, Chuan Cheah has collaborated with leading research institutions, universities, and tech companies to further develop his inventions and bring them to the market, solidifying his reputation as a visionary inventor.

Conclusion:

Chuan Cheah's relentless pursuit of innovation and his commitment to pushing the boundaries of what is possible make him a true pioneer in the world of technology, with a legacy that will continue to inspire future generations of inventors.

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