The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 19, 2017

Filed:

Sep. 09, 2015
Applicant:

Infineon Technologies Americas Corp., El Segundo, CA (US);

Inventors:

Eung San Cho, Torrance, CA (US);

Chuan Cheah, Torrance, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/04 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 25/11 (2006.01); H01L 23/538 (2006.01); H01L 23/58 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H01L 29/16 (2006.01); H01L 29/20 (2006.01); H01L 29/778 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 23/04 (2013.01); H01L 23/3107 (2013.01); H01L 23/49517 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 23/5386 (2013.01); H01L 23/58 (2013.01); H01L 25/074 (2013.01); H01L 25/115 (2013.01); H01L 25/117 (2013.01); H01L 25/18 (2013.01); H01L 29/16 (2013.01); H01L 29/2003 (2013.01); H01L 29/778 (2013.01); H01L 29/7827 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01);
Abstract

There are disclosed herein various implementations of a compact high-voltage semiconductor package. In one exemplary implementation, such a semiconductor package includes a power transistor, as well as a drain contact, a source contact, and a gate contact to provide external connections to the power transistor. The semiconductor package also includes a contour element formed between the drain contact and the source contact in the semiconductor package. The contour element increases a creepage distance between the drain contact and the source contact in the semiconductor package so as to increase a breakdown voltage of the semiconductor package.


Find Patent Forward Citations

Loading…