Chita Chuang

This inventor holds 50 USPTO granted patents and 3 published patent applications, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2014-2024.

USPTO Granted Patents = 50 (Patent Applications = 3)

% Patents Active = 88.0

Average Co-Inventor Count = 4.9

ph-index = 6

Forward Citations = 126(Granted Patents)

Forward Citations (Not Self Cited) = 110(Dec 10, 2025)

Location History:

Kaohsiung, TW (2014 - 2023)
Hsinchu, TW (2016 - 2023)

Company Filing History:

50 out of 42,759

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2014-2024

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Areas of Expertise:

Semiconductor Device

Packaging Assembly

Stress Reduction

Wireless Charging

Connector Structure

Bump on Pad

Dummy Flip Chip

Bonded Structures

Substrate Pad

Elongated Bump

Interconnection Structure

Metal Routing

50 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12113055 - Stress reduction apparatus and method (2024-10-08),

2. 11855025 - Semiconductor device and package assembly including the same (2023-12-26),

3. 11824026 - Connector structure and method of forming same (2023-11-21),

4. 11631993 - Wireless charging devices having wireless charging coils and methods of manufacture thereof (2023-04-18),

5. 11244940 - Stress reduction apparatus and method (2022-02-08),

6. 11088102 - Bonded structures for package and substrate (2021-08-10),

7. 10867810 - Substrate pad structure (2020-12-15),

8. 10861811 - Connector structure and method of forming same (2020-12-08),

9. 10784223 - Elongated bump structures in package structure (2020-09-22),

10. 10748785 - Substrate pad structure (2020-08-18),

11. 10734347 - Dummy flip chip bumps for reducing stress (2020-08-04),

12. 10720788 - Wireless charging devices having wireless charging coils and methods of manufacture thereof (2020-07-21),

13. 10692848 - Stress reduction apparatus and method (2020-06-23),

14. 10515917 - Bump on pad (BOP) bonding structure in semiconductor packaged device (2019-12-24),

15. 10483225 - Packaging assembly and method of making the same (2019-11-19),

Title: The Innovative Journey of Chita Chuang

Introduction: Chita Chuang, a pioneering inventor hailing from Kaohsiung, Taiwan, has made significant contributions to the world of technology with her groundbreaking innovations.

Latest Patents: Chita Chuang's latest patents focus on advancements in renewable energy technologies, particularly in the field of solar power efficiency and storage solutions.

Career Highlights: With a career spanning over two decades, Chita Chuang has established herself as a leading figure in the tech industry, holding multiple patents and receiving recognition for her innovative work.

Collaborations: Throughout her career, Chita Chuang has collaborated with various research institutions and universities to further develop and implement her inventions, showcasing her commitment to driving technological progress.

Conclusion: Chita Chuang's relentless pursuit of innovation and her dedication to creating sustainable solutions have solidified her reputation as a trailblazer in the world of technology.