logo

For the Inventor, By the Inventor

Kaohsiung, Taiwan

Chita Chuang

USPTO Granted Patents = 50 

Average Co-Inventor Count = 4.9

ph-index = 6

Forward Citations = 125(Granted Patents)

Forward Citations (Not Self Cited) = 110(Dec 10, 2025)


Location History:

  • Kaohsiung, TW (2014 - 2023)
  • Hsinchu, TW (2016 - 2023)

Company Filing History:

goldMedal50 out of 40,780 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2014-2024

Loading Chart...
Areas of Expertise:
Stress Reduction Apparatus
Semiconductor Device
Wireless Charging Devices
Bump On Pad Bonding
Bonded Structures
Metal Routing Architecture
Elongated Bump Structures
Interconnection Structure
Packaging Assembly
Dummy Flip Chip Bumps
Substrate Pad Structure
Connector Structure
50 patents (USPTO):Explore Patents
1. 12113055 - Stress reduction apparatus and method (2024-10-08),
2. 11855025 - Semiconductor device and package assembly including the same (2023-12-26),
3. 11824026 - Connector structure and method of forming same (2023-11-21),
4. 11631993 - Wireless charging devices having wireless charging coils and methods of manufacture thereof (2023-04-18),
5. 11244940 - Stress reduction apparatus and method (2022-02-08),
6. 11088102 - Bonded structures for package and substrate (2021-08-10),
7. 10867810 - Substrate pad structure (2020-12-15),
8. 10861811 - Connector structure and method of forming same (2020-12-08),
9. 10784223 - Elongated bump structures in package structure (2020-09-22),
10. 10748785 - Substrate pad structure (2020-08-18),
11. 10734347 - Dummy flip chip bumps for reducing stress (2020-08-04),
12. 10720788 - Wireless charging devices having wireless charging coils and methods of manufacture thereof (2020-07-21),
13. 10692848 - Stress reduction apparatus and method (2020-06-23),
14. 10515917 - Bump on pad (BOP) bonding structure in semiconductor packaged device (2019-12-24),
15. 10483225 - Packaging assembly and method of making the same (2019-11-19),

Title: The Innovative Journey of Chita Chuang

Introduction: Chita Chuang, a pioneering inventor hailing from Kaohsiung, Taiwan, has made significant contributions to the world of technology with her groundbreaking innovations.

Latest Patents: Chita Chuang's latest patents focus on advancements in renewable energy technologies, particularly in the field of solar power efficiency and storage solutions.

Career Highlights: With a career spanning over two decades, Chita Chuang has established herself as a leading figure in the tech industry, holding multiple patents and receiving recognition for her innovative work.

Collaborations: Throughout her career, Chita Chuang has collaborated with various research institutions and universities to further develop and implement her inventions, showcasing her commitment to driving technological progress.

Conclusion: Chita Chuang's relentless pursuit of innovation and her dedication to creating sustainable solutions have solidified her reputation as a trailblazer in the world of technology.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…