The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2019
Filed:
Feb. 26, 2018
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Chita Chuang, Kaohsiung, TW;
Yao-Chun Chunag, Taipei, TW;
Tsung-Shu Lin, Yonghe, TW;
Chen-Cheng Kuo, Chu-Pei, TW;
Chen-Shien Chen, Zhubei, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
A packaging assembly includes a semiconductor device. The semiconductor device includes a conductive pad having a first width, and an under-bump metallization (UBM) layer on the conductive pad, wherein the UBM layer has a second width greater than the first width. The semiconductor device further includes a conductive pillar on the UBM layer, and a cap layer over the conductive pillar, wherein the cap layer exposes sidewalls of the UBM layer. The packaging assembly further includes a substrate. The substrate includes a conductive region, and a mask layer overlying the substrate and exposing a portion of the conductive region. The packaging assembly further includes a joint solder structure between the conductive pillar and the conductive region.