The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2020
Filed:
Aug. 17, 2017
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Hao-Juin Liu, Kaohsiung, TW;
Chita Chuang, Hsinchu, TW;
Yao-Chun Chuang, Hsinchu, TW;
Ming Hung Tseng, Toufen Township, TW;
Chen-Shien Chen, Zhubei, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A device includes a plurality of first pads in a package substrate, wherein at least one first pad is of a first elongated shape, a plurality of vias in a dielectric layer and over the plurality of first pads, and a plurality of second pads over the package substrate, wherein at least one second pad is of a second elongated shape, and wherein the plurality of second pads is over a top surface of the dielectric layer and placed in a first region, a second region, a third region and a fourth region, and wherein second pads in two contiguous regions are oriented in two different directions.