IDiyas

For the Inventor, By the Inventor

Hsinchu, Taiwan

Ching-Hou Su

USPTO Granted Patents = 22

Average Co-Inventor Count = 4.6

ph-index = 3

Forward Citations = 62(Granted Patents)


Company Filing History:

goldMedal22 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2013-2025

where 'Filed Patents' based on already Granted Patents

22 patents (USPTO):
1. 12198910 - Permeance magnetic assembly (2025-01-14),
2. 12125746 - Passivation layer for integrated circuit structure and forming the same (2024-10-22),
3. 11854776 - Permeance magnetic assembly (2023-12-26),
4. 11721662 - Wafer bonding method and wafer bonding apparatus (2023-08-08),
5. 11695150 - Semiconductor structures having a micro-battery and methods for making the same (2023-07-04),
6. 11688633 - Passivation layer for integrated circuit structure and forming the same (2023-06-27),
7. 11488814 - Permeance magnetic assembly (2022-11-01),
8. 11211301 - Semiconductor device and method of manufacture (2021-12-28),
9. 11101491 - Semiconductor structures having a micro-battery and methods for making the same (2021-08-24),
10. 11069562 - Passivation layer for integrated circuit structure and forming the same (2021-07-20),
11. 10847490 - Bonding alignment tool (2020-11-24),
12. 10396054 - Bonding alignment tool (2019-08-27),
13. 10361449 - Semiconductor structures having a micro-battery and methods for making the same (2019-07-23),
14. 9776857 - Methods of fabricating micro electro mechanical system structures (2017-10-03),
15. 9650243 - Method and apparatus for a seal ring structure (2017-05-16),

Title: Ching-Hou Su: Innovator in Semiconductor Technology

Introduction

Ching-Hou Su is a notable inventor based in Hsinchu, Taiwan, with an impressive portfolio of 22 patents to his name. His contributions to the semiconductor industry, particularly through his work at Taiwan Semiconductor Manufacturing Company Limited (TSMC), illustrate his significant impact on technological innovation.

Latest Patents

Among his latest patents, Ching-Hou Su has developed a "Permeance Magnetic Assembly," which features an innovative design comprising an inner permeance annulus and an outer permeance annulus connected by magnets. This invention boasts an outer region with varying thickness, enhancing its efficiency and functionality. Another notable patent is the "Passivation Layer for Integrated Circuit Structure and Forming the Same." This patent describes an integrated circuit (IC) structure that incorporates a nitride-free passivation layer, elegantly extending from a conformally formed liner to a protecting layer. This advancement significantly contributes to the reliability and performance of integrated circuits.

Career Highlights

Ching-Hou Su works at Taiwan Semiconductor Manufacturing Company Limited, one of the world's leading semiconductor manufacturers. His role at TSMC allows him to collaborate with some of the brightest minds in technology, leading to innovative breakthroughs in semiconductor manufacturing processes. With 22 patents that underscore his expertise, Su’s work has been pivotal in advancing industry standards and technological capabilities.

Collaborations

Working alongside talented colleagues such as Chyi-Tsong Ni and Yi Hsun Chiu, Ching-Hou Su leverages a collaborative environment to enhance his innovative efforts. Together, they engage in developing solutions that push the boundaries of what is possible in semiconductor technology.

Conclusion

Ching-Hou Su exemplifies the spirit of innovation within the semiconductor industry. His contributions, including a remarkable array of patents, demonstrate a commitment to developing advanced technologies that shape the future. With continued collaboration and creativity, Su's work at TSMC will undoubtedly pave the way for future advancements in the field.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…