The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2023
Filed:
Nov. 04, 2020
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Yun-Tai Shih, Changhua, TW;
Ching-Hou Su, Hsinchu, TW;
Chyi-Tsong Ni, Hsinchu, TW;
I-Shi Wang, Taipei, TW;
Jeng-Hao Lin, Chubei, TW;
Kuan-Ming Pan, Hsinchu, TW;
Jui-Mu Cho, Chupei, TW;
Wun-Kai Tsai, Yunlin, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
A method of aligning two wafers during a bonding process includes aligning a first wafer having a plurality of alignment markings with a second wafer having a plurality of alignment markings. The method further includes placing a plurality of flags between the first wafer and the second wafer. The method further includes detecting movement of the plurality of flags with respect to the first wafer and the second wafer using at least one sensor. The method further includes determining whether the wafers remain aligned within an alignment tolerance based on the detected movement of the plurality of flags relative to the first wafer and the second wafer.