This inventor holds 4 USPTO granted patents. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2015-2023.
Company Filing History:
Years Active: 2015-2023
Title: Kuan-Ming Pan: Innovator in Wafer Bonding Technology
Introduction
Kuan-Ming Pan is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor manufacturing, particularly in wafer bonding technology. With a total of 4 patents to his name, Pan continues to push the boundaries of innovation in this critical area of technology.
Latest Patents
Among his latest patents, Pan has developed a "Wafer bonding method and wafer bonding apparatus." This method involves aligning two wafers during a bonding process by utilizing a series of alignment markings. The process includes placing flags between the wafers and detecting their movement using sensors to ensure proper alignment within a specified tolerance. Another significant invention is the "Bonding alignment tool," which features an alignment module that aligns wafers based on their markers. This apparatus also includes a flag placement module and a controller that assesses the alignment based on the timing of flags reaching their designated positions.
Career Highlights
Kuan-Ming Pan works at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work has been instrumental in enhancing the efficiency and accuracy of wafer bonding processes, which are crucial for the production of advanced semiconductor devices.
Collaborations
Pan collaborates with esteemed colleagues such as Wun-Kai Tsai and Chyi-Tsong Ni. Their combined expertise contributes to the innovative advancements in semiconductor technology.
Conclusion
Kuan-Ming Pan's contributions to wafer bonding technology exemplify his commitment to innovation in the semiconductor industry. His patents reflect a deep understanding of the complexities involved in wafer alignment and bonding processes.