Sanxia, Taiwan

I-Shi Wang

This inventor holds 27 USPTO granted patents and 5 published patent applications, primarily in Semiconductor Bonding. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2013-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: I-Shi Wang. Retrieved from https://idiyas.com/inventor/i-shi-wang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 27 

% Patents Active = 77.8

Average Co-Inventor Count = 4.4

ph-index = 2

Forward Citations = 16(Granted Patents)


Location History:

  • Sanxia Township, Taipei County, TW (2016)
  • New Taipei, TW (2016 - 2020)
  • Taipei, TW (2023)
  • Sanxia Township, TW (2013 - 2024)

Company Filing History:


Years Active: 2013-2026

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Areas of Expertise:
Semiconductor Substrate
Wafer Bonding
MEMS Package
Anti-Stiction Layer
Fusion Bonding
Acid Etch
Bonding Alignment
Micro-Battery
27 patents (USPTO):Explore Patents

Title: I-Shi Wang: Innovator in Semiconductor Bonding Technology

Introduction

I-Shi Wang is a prominent inventor based in Sanxia, Taiwan, renowned for his contributions to the field of semiconductor bonding technology. With an impressive record of 24 patents, Wang’s innovative methodologies have significantly enhanced the manufacturing processes within the semiconductor industry.

Latest Patents

Among his most recent patents, two notable innovations stand out:

1. **Methods and Systems for Improving Fusion Bonding**: This patent discloses techniques where plasma treatment is applied to a substrate before fusion bonding. The process involves leaving residual charge on the substrate, which is subsequently managed through an electrically conductive silicone cushion on a loading pin. By measuring the residual voltage on a silicon wafer, this system ensures optimal performance and longevity of the silicone cushion, thereby enhancing the quality of fusion bonds between substrates.

2. **Semiconductor Substrate Bonding Tool and Methods of Operation**: This patent describes a bonding tool designed with an uninterrupted gas supply line that connects valves from gas supply tanks directly to the processing chamber. By maintaining pressure consistency between the gas supply line and the processing chamber, this innovation prevents premature bonding of semiconductor substrates and promotes more efficient operations.

Career Highlights

Wang currently works at Taiwan Semiconductor Manufacturing Company Ltd., a key player in the semiconductor industry. His expertise in semiconductor bonding technology has placed him at the forefront of research and development within the company, driving innovation and enhancing production efficiency.

Collaborations

Throughout his career, Wang has collaborated with notable colleagues such as Jen-Hao Liu and Chyi-Tsong Ni. These collaborations have fostered a productive exchange of ideas and technical knowledge, further advancing the field of semiconductor manufacturing.

Conclusion

I-Shi Wang's contributions through his patents and collaborative efforts illustrate the critical role of innovation in the semiconductor industry. As technology continues to evolve, his work remains influential, paving the way for future advancements in bonding techniques and production methods.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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