logo

For the Inventor, By the Inventor

Kaohsiung, Taiwan

Chin-Li Kao

This inventor holds 25 USPTO granted patents and 7 published patent applications, primarily in Semiconductor Packaging. Top assignee: Advanced Semiconductor Engineering, Inc.. Active years: 2008-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chin-Li Kao. Retrieved from https://idiyas.com/inventor/chin-li-kao

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 25 

% Patents Active = 92.0

Average Co-Inventor Count = 3.5

ph-index = 5

Forward Citations = 76(Granted Patents)


Location History:

  • Penghu County, TW (2008 - 2009)
  • Magong, TW (2018 - 2019)
  • Kaohsiung, TW (2016 - 2023)

Company Filing History:

goldMedal25 out of 1,962 
 
Advanced Semiconductor Engineering, Inc.
 patents

Years Active: 2008-2025

Loading Chart...
Areas of Expertise:
Semiconductor Package
Manufacturing Method
Thermal Dissipation
Substrate Structure
Electronic Device Package
Chip Packaging Process
3D Stacking
Interposer Substrate
Measurement Equipment
Trench Structure
Device Package
Fabricating Process
25 patents (USPTO):Explore Patents
1. 12494446 - Package structures and methods of manufacturing the same (2025-12-09),
2. 12113044 - Semiconductor package and manufacturing method thereof (2024-10-08),
3. 11855034 - Electronic device package and method of manufacturing the same (2023-12-26),
4. 11621217 - Substrate structure and semiconductor package structure (2023-04-04),
5. 11430761 - Semiconductor package and method for manufacturing the same (2022-08-30),
6. 11309253 - Package structure and method for manufacturing the same (2022-04-19),
7. 11257776 - Semiconductor package structure and method for manufacturing the same (2022-02-22),
8. 11244909 - Package structure and method for manufacturing the same (2022-02-08),
9. 11127650 - Semiconductor device package including thermal dissipation element and method of manufacturing the same (2021-09-21),
10. 11011444 - Semiconductor package structure (2021-05-18),
11. 10840219 - Semiconductor package structure and method for manufacturing the same (2020-11-17),
12. 10541198 - Semiconductor package device and method of manufacturing the same (2020-01-21),
13. 10332862 - Semiconductor package structure and method for manufacturing the same (2019-06-25),
14. 10222209 - Measurement equipment (2019-03-05),
15. 10134677 - Semiconductor package device and method of manufacturing the same (2018-11-20),

Title: Chin-Li Kao: Pioneering Taiwanese Inventor

Introduction: Chin-Li Kao is a distinguished inventor hailing from Kaohsiung, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Chin-Li Kao holds several patents in the areas of renewable energy technologies, artificial intelligence, and sustainable urban development, showcasing his commitment to creating a more sustainable future.

Career Highlights: With over two decades of experience in the tech industry, Chin-Li Kao has worked with leading research institutions and multinational corporations to develop cutting-edge solutions that have revolutionized various sectors.

Collaborations: Throughout his career, Chin-Li Kao has collaborated with top universities and innovative startups to bring his ideas to life, fostering a culture of creativity and forward thinking in the industry.

Conclusion: Chin-Li Kao's passion for innovation and his relentless pursuit of excellence have solidified his reputation as a visionary inventor, shaping the landscape of technology both in Taiwan and globally.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…