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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10541198 B1

PDFFull Text
Date of Patent:
Jan. 21, 2020

Filed:

Jan. 30, 2018

Semiconductor package device and method of manufacturing the same

Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Chien Lin Chang Chien, Kaohsiung, TW;

Chin-Li Kao, Kaohsiung, TW;

Chang Chi Lee, Kaohsiung, TW;

Chih-Pin Hung, Kaohsiung, TW;

Assignee:

ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;

Attorneys:

Foley & Lardner LLP

Cliff Z. Liu

Primary Examiner:

Walter H Swanson

Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 23/16 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 25/065 (2006.01); H01L 21/683 (2006.01); H01L 21/48 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49816 (2013.01); H01L 21/6835 (2013.01); H01L 23/16 (2013.01); H01L 23/49838 (2013.01); H01L 23/49894 (2013.01); H01L 23/528 (2013.01); H01L 23/5226 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01); H01L 21/4853 (2013.01); H01L 23/3128 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/49833 (2013.01); H01L 23/562 (2013.01); H01L 2221/68331 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81005 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/83005 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3512 (2013.01);
Abstract

A method of manufacturing a semiconductor package includes: (a) providing a carrier; (b) disposing a dielectric layer and a conductive pad on the carrier; (c) disposing a redistribution layer on the dielectric layer to electrically connect to the conductive pad; (d) connecting a die to the redistribution layer; (e) removing at least a portion of the carrier to expose the conductive pad; and (f) disposing an electrical contact to electrically connect to the conductive pad.

Find Patent Forward Citations

Chang Chien, Chien. (2020). Semiconductor package device and method of manufacturing the same (U.S. Patent No. 10541198). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10541198

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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