The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2024
Filed:
Feb. 18, 2022
Applicant:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Inventors:
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/10 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/81 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/14 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 25/105 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49833 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/13105 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13582 (2013.01); H01L 2224/13605 (2013.01); H01L 2224/13611 (2013.01); H01L 2224/13647 (2013.01); H01L 2224/14505 (2013.01); H01L 2224/16157 (2013.01); H01L 2224/16167 (2013.01); H01L 2224/16506 (2013.01); H01L 2224/17505 (2013.01); H01L 2224/81097 (2013.01); H01L 2224/81211 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/81825 (2013.01); H01L 2224/81935 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1041 (2013.01); H01L 2225/1058 (2013.01);
Abstract
A semiconductor device package and a fabrication method thereof are disclosed. The semiconductor package comprises: a package component having a first mounting surface and a second mounting surface; and a first electronic component having a first conductive pad signal communicatively mounted on the first mounting surface through a first type connector; wherein the first type connector comprises a first solder composition having a lower melting point layer sandwiched between a pair of higher melting point layers, wherein the lower melting point layer is composed of alloys capable of forming a room temperature eutectic.