Shan-Bo Wang

Title: Innovations of Shan-Bo Wang in Semiconductor Technology

Introduction

Shan-Bo Wang is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of semiconductor packaging. His innovative approach has led to the development of a unique semiconductor device package that enhances performance and reliability.

Latest Patents

Shan-Bo Wang holds a patent for a semiconductor package and its manufacturing method. The patent describes a semiconductor package that includes a package component with a first and second mounting surface. It features a first electronic component that is mounted on the first surface through a first type connector. This connector utilizes a solder composition with a lower melting point layer sandwiched between two higher melting point layers. The lower melting point layer is composed of alloys that can form a room temperature eutectic, which is a significant advancement in semiconductor packaging technology. He has 1 patent to his name.

Career Highlights

Shan-Bo Wang is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate in semiconductor technologies. His work has been instrumental in improving the efficiency and effectiveness of semiconductor devices, making them more reliable for various applications.

Collaborations

Shan-Bo Wang has collaborated with several talented individuals in his field, including Chin-Li Kao and An-Hsuan Hsu. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Shan-Bo Wang's contributions to semiconductor technology exemplify the importance of innovation in the industry. His patent and ongoing work at Advanced Semiconductor Engineering, Inc. highlight his commitment to advancing semiconductor packaging methods. His achievements serve as an inspiration for future inventors in the field.