The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 2025
Filed:
Aug. 19, 2022
Applicant:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Inventors:
An-Hsuan Hsu, Kaohsiung, TW;
Chin-Li Kao, Kaohsiung, TW;
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2023.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/08 (2013.01); H01L 23/49811 (2013.01); H01L 23/49838 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 25/0657 (2013.01); H01L 2224/05541 (2013.01); H01L 2224/05556 (2013.01); H01L 2224/05605 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/08221 (2013.01); H01L 2224/08503 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32221 (2013.01); H01L 2224/80098 (2013.01); H01L 2224/80815 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/83098 (2013.01); H01L 2225/06524 (2013.01); H01L 2225/06527 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/35121 (2013.01);
Abstract
A package structure is disclosed. The package structure includes a substrate including a conductive element and a plurality of wires having a surface area through which heat of the conductive element can be dissipated, lowering a bonding temperature of the conductive element. The package structure also includes a conductive layer disposed between the conductive element of the substrate and the plurality of wires. The conductive contact layer attaches the plurality of wires over the conductive element.