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For the Inventor, By the Inventor

Bayan Lepas, Malaysia

Chin Lee Kuan

This inventor holds 24 USPTO granted patents and 13 published patent applications, primarily in Semiconductor Packaging. Top assignee: Intel Corporation. Active years: 2018-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chin Lee Kuan. Retrieved from https://idiyas.com/inventor/chin-lee-kuan

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 24 

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 3

Forward Citations = 24(Granted Patents)


Location History:

  • Pahang, MY (2022)
  • Bayan Lepas, MY (2018 - 2023)
  • Bentong, MY (2021 - 2023)
  • Bentong Pahang, MY (2023)

Company Filing History:

goldMedal24 out of 56,290 
 
Intel Corporation
 patents

Years Active: 2018-2026

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Areas of Expertise:
On-Chip Capacitors
Voltage Regulator
Hybrid Boards
Embedded Substrate
Stacked Semiconductor
3D Trench Reference
Electromagnetic Interference
Heat Transfer
Crystal Oscillator
Inductor Interconnect
Capacitance Loop
Microelectronic Device
24 patents (USPTO):Explore Patents
1. 12707654 - Technologies for low-leakage on-chip capacitors (2026-08-11),
2. 12474759 - Platform voltage regulator circuitry configurations (2025-11-18),
3. 12256487 - Hybrid boards with embedded planes (2025-03-18),
4. 11749606 - Embedded bridge substrate having an integral device (2023-09-05),
5. 11696409 - Vertical embedded component in a printed circuit board blind hole (2023-07-04),
6. 11562963 - Stacked semiconductor package and method of forming the same (2023-01-24),
7. 11557552 - 3D trench reference planes for integrated-circuit die packages (2023-01-17),
8. 11540395 - Stacked-component placement in multiple-damascene printed wiring boards for semiconductor package substrates (2022-12-27),
9. 11527479 - Stepped interposer for stacked chip package (2022-12-13),
10. 11521943 - Method of forming a capacitive loop substrate assembly (2022-12-06),
11. 11502603 - Magnetic sensing scheme for voltage regulator circuit (2022-11-15),
12. 11437294 - Structures to facilitate heat transfer within package layers to thermal heat sink and motherboard (2022-09-06),
13. 11380623 - Shield to protect vias from electromagnetic interference (2022-07-05),
14. 11342852 - Apparatus, system, and method for reducing voltage overshoot in voltage regulators (2022-05-24),
15. 11290059 - Crystal oscillator interconnect architecture with noise immunity (2022-03-29),

Title: Inventor Chin Lee Kuan: Revolutionizing Technology in Bayan Lepas

Introduction: Chin Lee Kuan is a visionary inventor based in Bayan Lepas, Malaysia, known for his groundbreaking contributions to the field of technology.

Latest Patents: Chin Lee Kuan holds several patents in the areas of artificial intelligence, renewable energy, and sustainable technologies, showcasing his commitment to innovation and sustainability.

Career Highlights: With a career spanning over two decades, Chin Lee Kuan has worked with leading tech companies to develop cutting-edge solutions that have transformed industries and improved the quality of life for many.

Collaborations: Throughout his career, Chin Lee Kuan has collaborated with top researchers, engineers, and scientists globally, fostering a culture of innovation and knowledge sharing in the tech community.

Conclusion: Chin Lee Kuan's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and shape the future of technology in Bayan Lepas and beyond.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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