The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 2022

Filed:

Mar. 28, 2018
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Sameer Shekhar, Portland, OR (US);

Chin Lee Kuan, Pahang, MY;

Amit Kumar Jain, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01F 27/36 (2006.01); H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01F 27/363 (2020.08); H01F 27/366 (2020.08); H01L 23/49827 (2013.01); H01L 24/32 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/1437 (2013.01); H01L 2924/3025 (2013.01); H05K 9/0024 (2013.01);
Abstract

Embodiments herein relate to a package having a substrate with a core layer with a plurality of conductors coupling a first side of the core layer with a second side of the core layer, and a shield within the core layer that separates a first conductor of the plurality of conductors from a second conductor of the plurality of conductors where the shield is to reduce electromagnetic interference received by the second conductor that is generated by the first conductor. Embodiments may also be related to a package having a substrate with a through hole via through the substrate, where an EMI protective material is applied to a surface of the substrate that forms the via to shield an inner portion of the via.


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