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For the Inventor, By the Inventor

Cupertino, CA, United States of America

Chih-Ming Chung

This inventor holds 11 USPTO granted patents and 3 published patent applications and 1 EPO patent. Top assignee: Apple Inc.. Active years: 2013-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chih-Ming Chung. Retrieved from https://idiyas.com/inventor/chih-ming-chung-ulgedmqh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 11 

% Patents Active = 81.8

 

Average Co-Inventor Count = 1.6

ph-index = 3

Forward Citations = 51(Granted Patents)


Company Filing History:

goldMedal11 out of 43,688 
 
Apple Inc.
 patents

Years Active: 2013-2026

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11 patents (USPTO):Explore Patents
1. 12745681 - Chip singulation assisted structures and methods for improving bonding interface quality (2026-09-22),
2. 11908819 - Semiconductor packaging substrate fine pitch metal bump and reinforcement structures (2024-02-20),
3. 11545455 - Semiconductor packaging substrate fine pitch metal bump and reinforcement structures (2023-01-03),
4. 9754924 - Fan-out pop stacking process (2017-09-05),
5. 9601464 - Thermally enhanced package-on-package structure (2017-03-21),
6. 9583472 - Fan out system in package and method for forming the same (2017-02-28),
7. 9379097 - Fan-out PoP stacking process (2016-06-28),
8. 9263426 - PoP structure with electrically insulating material between packages (2016-02-16),
9. 8963311 - PoP structure with electrically insulating material between packages (2015-02-24),
10. 8766424 - Thin substrate PoP structure (2014-07-01),
11. 8546932 - Thin substrate PoP structure (2013-10-01),

Title: Chih-Ming Chung: Innovator in Semiconductor Packaging

Introduction

Chih-Ming Chung is a prominent inventor based in Cupertino, CA (US). He has made significant contributions to the field of semiconductor packaging, holding a total of 11 patents. His work focuses on enhancing the efficiency and effectiveness of semiconductor packaging substrates.

Latest Patents

One of Chih-Ming Chung's latest patents involves semiconductor packaging substrate fine pitch metal bump and reinforcement structures. This patent describes semiconductor packaging substrates and processing sequences. In one embodiment, a packaging substrate includes a build-up structure and a patterned metal contact layer that is partially embedded within the build-up structure and protrudes from it. The patterned metal contact layer may consist of an array of surface mount (SMT) metal bumps in a chip mount area, a metal dam structure, or a combination of both.

Career Highlights

Chih-Ming Chung has established a successful career at Apple Inc., where he continues to innovate in semiconductor technology. His expertise in packaging substrates has positioned him as a key player in the development of advanced electronic components.

Collaborations

Chih-Ming Chung has collaborated with notable colleagues such as Jun Zhai and Yizhang Yang. Their combined efforts contribute to the advancement of semiconductor technologies and innovations.

Conclusion

Chih-Ming Chung's work in semiconductor packaging has made a lasting impact on the industry. His patents and collaborations reflect his commitment to innovation and excellence in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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