The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2013

Filed:

Aug. 15, 2012
Applicant:

Chih-ming Chung, Cupertino, CA (US);

Inventor:

Chih-Ming Chung, Cupertino, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A PoP (package-on-package) package includes a bottom package with a substrate encapsulated in an encapsulant with a die coupled to the top of the substrate. At least a portion of the die is exposed above the encapsulant on the bottom package substrate. A top package includes a substrate with encapsulant on both the frontside and the backside of the substrate. The backside of the top package substrate is coupled to the topside of the bottom package substrate with at least part of the die being located in a recess in the encapsulant on the backside of the top package substrate.


Find Patent Forward Citations

Chung, Chih-Ming. (2013). Thin substrate pop structure (U.S. Patent No. 8546932). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8546932

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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