The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2016

Filed:

Sep. 23, 2014
Applicant:

Apple Inc., Cupertino, CA (US);

Inventor:

Chih-Ming Chung, Cupertino, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 25/00 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); H01L 21/561 (2013.01); H01L 21/563 (2013.01); H01L 21/78 (2013.01); H01L 23/49838 (2013.01); H01L 24/75 (2013.01); H01L 24/81 (2013.01); H01L 24/96 (2013.01); H01L 25/0657 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/40108 (2013.01); H01L 2224/41171 (2013.01); H01L 2224/48108 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/49173 (2013.01); H01L 2224/751 (2013.01); H01L 2224/753 (2013.01); H01L 2224/7555 (2013.01); H01L 2224/75981 (2013.01); H01L 2224/8136 (2013.01); H01L 2224/81203 (2013.01); H01L 2924/15172 (2013.01);
Abstract

Package on package structures and manners of formation are described. In an embodiment, an array of trenches is formed partially through a fan-out substrate. In an embodiment, a plurality of laterally separate locations thermal interface material is dispensed onto an array of embedded bottom die. In an embodiment a thermal compression tool including an array of cavities corresponding to an array of top packages is brought into contact with the array of top packages and underlying fan-out substrate during PoP joint formation. The fan-out substrate may be secured to a vacuum chuck during several processing operations.


Find Patent Forward Citations

Chung, Chih-Ming. (2016). Fan-out pop stacking process (U.S. Patent No. 9379097). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9379097

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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