The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2017
Filed:
Mar. 03, 2015
Applicant:
Apple Inc., Cupertino, CA (US);
Inventors:
Chih-Ming Chung, Cupertino, CA (US);
Jun Zhai, Cupertino, CA (US);
Yizhang Yang, Sunnyvale, CA (US);
Assignee:
Apple Inc., Cupertino, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/18 (2006.01); H01L 21/56 (2006.01); H01L 21/768 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01); H01L 23/48 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 23/34 (2006.01); H01L 23/552 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 21/565 (2013.01); H01L 21/768 (2013.01); H01L 23/3107 (2013.01); H01L 23/34 (2013.01); H01L 23/3675 (2013.01); H01L 23/481 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 23/552 (2013.01); H01L 24/14 (2013.01); H01L 24/19 (2013.01); H01L 24/32 (2013.01); H01L 24/97 (2013.01); H01L 25/0652 (2013.01); H01L 25/16 (2013.01); H01L 25/50 (2013.01); H01L 21/568 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/2732 (2013.01); H01L 2224/27318 (2013.01); H01L 2224/27436 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/81005 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/82031 (2013.01); H01L 2224/82039 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83855 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/83874 (2013.01); H01L 2224/92225 (2013.01); H01L 2224/92244 (2013.01); H01L 2224/94 (2013.01); H01L 2224/97 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06555 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/12 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/19011 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19103 (2013.01); H01L 2924/19104 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/3511 (2013.01);
Abstract
Packages and methods of formation are described. In an embodiment, a system in package (SiP) includes first and second redistribution layers (RDLs), stacked die between the first and second RDLs, and conductive pillars extending between the RDLs. A molding compound may encapsulate the stacked die and conductive pillars between the first and second RDLs.