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For the Inventor, By the Inventor

Kaohsiung County, Taiwan

Chih-Ming Chung

USPTO Granted Patents = 15

Average Co-Inventor Count = 1.8

ph-index = 6

Forward Citations = 220(Granted Patents)


Location History:

  • Kaohsiung Hsien, TW (2000 - 2001)
  • Kaohsiung County, TW (2007 - 2013)
  • Dashe Township, Kaohsiung County, TW (2013)
  • Kaohsiung, TW (2005 - 2014)

Company Filing History:

goldMedal15 out of 1,867 
 
Advanced Semiconductor Engineering, Inc.
 patents

Years Active: 2000-2014

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15 patents (USPTO):
1. 8889488 - Method for manufacturing semiconductor package (2014-11-18),
2. 8546950 - Semiconductor package and manufacturing method thereof (2013-10-01),
3. 8384204 - Circuit carrier and semiconductor package using the same (2013-02-26),
4. 7834469 - Stacked type chip package structure including a chip package and a chip that are stacked on a lead frame (2010-11-16),
5. 7565737 - Manufacturing method of package substrate (2009-07-28),
6. 7482200 - Process for fabricating chip package structure (2009-01-27),
7. 7375435 - Chip package structure (2008-05-20),
8. 7327018 - Chip package structure, package substrate and manufacturing method thereof (2008-02-05),
9. 7262510 - Chip package structure (2007-08-28),
10. 7163840 - Flip chip package and manufacturing method thereof (2007-01-16),
11. 7125745 - Multi-chip package substrate for flip-chip and wire bonding (2006-10-24),
12. 7098071 - Method for flip chip bonding by utilizing an interposer with embedded bumps (2006-08-29),
13. 6921968 - Stacked flip chip package (2005-07-26),
14. 6201299 - Substrate structure of BGA semiconductor package (2001-03-13),
15. 6150730 - Chip-scale semiconductor package (2000-11-21),

Title: Chih-Ming Chung: Innovator in Semiconductor Packaging

Introduction

Chih-Ming Chung is a prominent inventor based in Kaohsiung County, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 15 patents. His innovative work has advanced the technology used in semiconductor manufacturing, making it more efficient and effective.

Latest Patents

Chih-Ming Chung's latest patents include a method for manufacturing a semiconductor package. This semiconductor package consists of a substrate, a semiconductor element, a package body, and a conductive part. The substrate features an electrical contact, while the semiconductor element is positioned on the substrate. The package body encases the semiconductor element and includes a through hole that exposes the electrical contact. Notably, the package body is composed of a resin body and multiple fiber layers, which define a series of fiber apertures arranged in an array. The conductive part is electrically connected to the substrate through the through hole, showcasing Chung's innovative approach to semiconductor packaging.

Career Highlights

Chih-Ming Chung is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to develop cutting-edge technologies in semiconductor packaging. His work has been instrumental in enhancing the performance and reliability of semiconductor devices.

Collaborations

Chih-Ming Chung has collaborated with notable colleagues, including Su Tao and Chien Cheng Liu. These partnerships have fostered a creative environment that encourages innovation and the development of new technologies in the semiconductor industry.

Conclusion

Chih-Ming Chung is a key figure in the semiconductor packaging field, with a strong portfolio of patents that reflect his innovative spirit. His contributions continue to shape the future of semiconductor technology, making him a valuable asset to the industry.

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