The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 2010
Filed:
Apr. 22, 2009
Yao-kai Chuang, Kaohsiung, TW;
Chien Liu, Kaohsiung, TW;
Chih-ming Chung, Kaohsiung County, TW;
Chao-cheng Liu, Kaohsiung County, TW;
Yao-Kai Chuang, Kaohsiung, TW;
Chien Liu, Kaohsiung, TW;
Chih-Ming Chung, Kaohsiung County, TW;
Chao-Cheng Liu, Kaohsiung County, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
A stacked type chip package structure including a lead frame, a chip package, a second chip, and a second molding compound is provided. The lead frame includes a plurality of first leads and second leads insulated from one another. The first leads have a first upper surface, and the second leads have a second upper surface which is not co-planar with the first upper surface. The chip package is disposed on the first leads and includes a substrate, a first chip, and a first molding compound. The second chip is stacked on the chip package and electrically connected to the second leads. The second molding compound is disposed on the lead frame and filled among the first leads and the second leads for encapsulating the chip package and the second chip.