The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 16, 2007
Filed:
May. 17, 2004
Yu-wen Chen, Kaohsiung, TW;
Chih-ming Chung, Kaohsiung County, TW;
Chi-hao Chiu, Pintung County, TW;
Yu-Wen Chen, Kaohsiung, TW;
Chih-Ming Chung, Kaohsiung County, TW;
Chi-Hao Chiu, Pintung County, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
A flip chip package structure and manufacturing method thereof is provided. A chip is electrically connected to a substrate. A heat sink is attached to the backside of the chip. The heat sink has at least a through hole located at a peripheral region and laterally adjacent to the chip. A dispensing process is carried out to deliver an underfill material via the through hole such that the space between the chip and the substrate is filled. The underfill material also extends to cover a portion of the heat sink so that the heat sink and the substrate are connected together. The underfill material is cured to fix the heat sink, the substrate and the chip in position.