The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2008
Filed:
Feb. 24, 2005
Meng-jen Wang, Pingtung, TW;
Chih-ming Chung, Kaohsiung County, TW;
Meng-Jen Wang, Pingtung, TW;
Chih-Ming Chung, Kaohsiung County, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
A chip package structure comprising a substrate, a chip, a plurality of bumps, some buffer material and some encapsulation is provided. The substrate has a first surface and a corresponding second surface. The chip has an active surface and a back surface. The bumps are disposed between the active surface of the chip and the first surface of the substrate. The buffer material is disposed on the back surface of the chip. The encapsulation is disposed over the first surface of the substrate to enclose the chip and the buffer material.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile