The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2006
Filed:
May. 24, 2005
Ming-lun Ho, Kaohsiung, TW;
Chih-ming Chung, Kaohsiung, TW;
Ming-Lun Ho, Kaohsiung, TW;
Chih-Ming Chung, Kaohsiung, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
The present invention relates to a method for flip chip bonding by utilizing an interposer with embedded bumps. The method comprises (a) providing a first element having a first surface; (b) forming an interposer onto the first surface; (c) forming a plurality of openings on the interposer; (d) forming a plurality of bumps in the openings, wherein the height of the bumps is smaller than the depth of the openings; (e) providing a second element having a plurality of pre-solders; and (f) bonding the first surface onto the second element, so that the pre-solders are disposed in the openings and in contact with the bumps. As a result, the self-alignment between the pre-solders and the bumps can avoid the shift between the first element and the second element.