Ming-Lun Ho

Title: Innovations of Ming-Lun Ho

Introduction

Ming-Lun Ho is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 5 patents. His work focuses on enhancing the efficiency and effectiveness of electronic package structures.

Latest Patents

One of his latest patents is the "Flip chip stacked package." This invention primarily comprises a carrier, a lower chip, an upper chip, a plurality of bumps, a plurality of bonding wires, and a supporter. The supporter is attached to the lower surface of the carrier via an adhesive and covers the opening of the carrier. Thus, the lower chip can be disposed in the opening. In addition, the lower chip is electrically flip-chip bonded to the upper chip via the bumps and electrically connected to the carrier via the bonding wires. Accordingly, the heat generated from the lower chip can be transmitted to outside via the supporter. Furthermore, the upper chip is directly exposed to outside so that the capability of heat dissipation will be enhanced.

Another notable patent is the "Process of cutting electronic package." This invention provides a cutting process for cutting connected electronic package structures. The connected electronic package structures are connected through a mother carrier. Each electronic package structure includes at least an electronic component and a carrier unit, while the mother carrier includes at least a plurality of carrier units and a plurality of cutting regions, each cutting region being disposed between two adjacent carrier units. After forming at least a supporting portion on the first surface of the mother carrier and on a portion of the cutting region of the mother carrier, the mother carrier is positioned to a supportive plane, so that the supporting portion is in contact with the supportive plane. From a second surface of the mother carrier, cutting the mother carrier at the cutting regions separates the electronic package structures alongside the cutting regions.

Career Highlights

Ming-Lun Ho is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate in the semiconductor field. His work has significantly impacted the efficiency of electronic packaging, making him a valuable asset to his company.

Collaborations

He has collaborated with notable coworkers, including Yu-Wen Chen and Shih-Chang Lee, contributing to various projects that enhance semiconductor technology.

Conclusion

Ming-Lun Ho's contributions to semiconductor packaging through his innovative patents demonstrate his expertise