The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2007
Filed:
Jul. 29, 2004
Sung-fei Wang, Kaohsiung, TW;
Ming-lun Ho, Kaohsiung, TW;
Sung-Fei Wang, Kaohsiung, TW;
Ming-Lun Ho, Kaohsiung, TW;
Advanced Semiconductor Engineering, Inc., Kaoshiung, TW;
Abstract
A flip chip stacked package mainly comprises a carrier, a lower chip, an upper chip, a plurality of bumps, a plurality of bonding wires and a supporter. The supporter is attached to the lower surface of the carrier via an adhesive and covers the opening of the carrier. Thus, the lower chip can be disposed in the opening. In addition, the lower chip is electrically flip-chip bonded to the upper chip via the bumps and electrically connected to the carrier via the bonding wires. Accordingly, the heat generated from the lower chip can be transmitted to outside via the supporter. Furthermore, the upper chip is directly exposed to outside so that the capability of the heat dissipation will be enhanced.