Sung-Fei Wang

Title: The Innovative Contributions of Sung-Fei Wang

Introduction

Sung-Fei Wang is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 15 patents. His work focuses on enhancing the efficiency and performance of electronic components through innovative packaging solutions.

Latest Patents

Among his latest patents, the "Flip-chip package" stands out. This invention comprises a substrate with an opening, where a dummy die is disposed onto the substrate corresponding to the opening. The design allows for a composite chip carrier with a chip cavity, featuring a redistribution layer that includes multiple flip-chip pads for connection. This innovation aims to achieve thinner package thickness, high heat dissipation, and fine pitch flip-chip mounting while eliminating stress on the chip. Another notable patent is the "Flip chip stacked package," which includes a carrier, a lower chip, an upper chip, and various bonding components. This design enhances heat dissipation by allowing the lower chip to transmit heat outside through a supporter, while the upper chip remains exposed for improved thermal management.

Career Highlights

Sung-Fei Wang is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to push the boundaries of semiconductor technology. His work has been instrumental in developing advanced packaging solutions that meet the demands of modern electronics.

Collaborations

Throughout his career, Wang has collaborated with notable colleagues, including Chaur-Chin Yang and Jian-Wen Chen. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Sung-Fei Wang's contributions to semiconductor packaging are noteworthy and reflect his commitment to innovation. His patents not only enhance the performance of electronic devices but also pave the way for future advancements in the field.