The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2007
Filed:
Nov. 09, 2004
Ming-lun Ho, Kaohsiung, TW;
Ming-chieh Kao, Kaohsiung, TW;
Ming-Lun Ho, Kaohsiung, TW;
Ming-Chieh Kao, Kaohsiung, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
The present invention provides a cutting process for cutting connected electronic package structures. The connected electronic package structures are connected through a mother carrier. Each electronic package structures includes at least an electronic component and a carrier unit, while the mother carrier includes at least a plurality of carrier units and a plurality of cutting regions, each cutting region being disposed between two adjacent carrier units. After forming at least a supporting portion on the first surface of the mother carrier and on a portion of the cutting region of the mother carrier, the mother carrier is positioned to a supportive plane, so that the supporting portion is in contact with the supportive plane. From a second surface of the mother carrier, cutting the mother carrier at the cutting regions, so that the electronic package structures alongside the cutting regions are separated.