Company Filing History:
Years Active: 2007
Title: The Innovative Contributions of Ming-Chieh Kao
Introduction
Ming-Chieh Kao is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of electronic packaging through his innovative patent. His work focuses on improving the efficiency and effectiveness of cutting processes in electronic package structures.
Latest Patents
Ming-Chieh Kao holds a patent for a process of cutting electronic package structures. This invention provides a cutting process for connected electronic package structures that are linked through a mother carrier. Each electronic package structure includes at least one electronic component and a carrier unit, while the mother carrier consists of multiple carrier units and cutting regions. The process involves forming a supporting portion on the first surface of the mother carrier and positioning it on a supportive plane. The cutting is then performed from the second surface of the mother carrier at the designated cutting regions, allowing for the separation of electronic package structures.
Career Highlights
Ming-Chieh Kao is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to develop innovative solutions in the semiconductor industry. His expertise in electronic packaging has positioned him as a valuable asset to his company and the field at large.
Collaborations
Ming-Chieh Kao collaborates with his coworker, Ming-Lun Ho, to further enhance their research and development efforts in electronic packaging technologies.
Conclusion
Ming-Chieh Kao's contributions to the field of electronic packaging through his innovative patent demonstrate his commitment to advancing technology in the semiconductor industry. His work not only improves manufacturing processes but also enhances the overall efficiency of electronic components.