The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 28, 2006
Filed:
Dec. 24, 2003
Yu-wen Chen, Kaohsiung, TW;
Ming-lun Ho, Kaohsiung, TW;
Shih-chang Lee, Kaohsiung, TW;
Chih-huang Chang, Tainan Hsien, TW;
Yu-Wen Chen, Kaohsiung, TW;
Ming-Lun Ho, Kaohsiung, TW;
Shih-Chang Lee, Kaohsiung, TW;
Chih-Huang Chang, Tainan Hsien, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
A flip chip package structure comprising a chip, a substrate, at least a first bump and a plurality of second bumps is provided. The chip has a first bump-positioning region and the substrate has a second bump-positioning region. The substrate has at least a first hole and multiple second holes. The first hole and the second holes are located within the second bump-positioning region. The first hole has a depth greater than that of the second hole. The first bump is set up between the first bump-positioning region of the chip and the second bump-positioning region of the substrate. The first bump is bonded to the substrate through the first holes. The second bumps are set up between the first bump-positioning region of the chip and the second bump-positioning region of the substrate. The second bumps are bonded to the substrate through the second holes. The first bump has a volume greater than the volume of the second bump.