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For the Inventor, By the Inventor

Tainan, Taiwan

Chih-Huang Chang

This inventor holds 11 USPTO granted patents. Top assignee: Advanced Semiconductor Engineering, Inc.. Active years: 2004-2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chih-Huang Chang. Retrieved from https://idiyas.com/inventor/chih-huang-chang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 11

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 7

Forward Citations = 164(Granted Patents)


Location History:

  • Tainan Hsien, TW (2004 - 2006)
  • Yungkang, TW (2006)
  • Yongkang, TW (2006 - 2007)
  • Tainan, TW (2007)
  • Tainan County, TW (2009)
  • Kaohsiung, TW (2010)

Company Filing History:

goldMedal11 out of 1,968 
 
Advanced Semiconductor Engineering, Inc.
 patents

Years Active: 2004-2010

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11 patents (USPTO):Explore Patents
1. 7790505 - Semiconductor chip package manufacturing method and structure thereof (2010-09-07),
2. 7602053 - Leadframe of a leadless flip-chip package and method for manufacturing the same (2009-10-13),
3. 7312105 - Leadframe of a leadless flip-chip package and method for manufacturing the same (2007-12-25),
4. 7222124 - Internet automatic electric data system (2007-05-22),
5. 7221041 - Multi-chips module package and manufacturing method thereof (2007-05-22),
6. 7049689 - Chip on glass package (2006-05-23),
7. 7019407 - Flip chip package structure (2006-03-28),
8. 7015571 - Multi-chips module assembly package (2006-03-21),
9. 6891274 - Under-bump-metallurgy layer for improving adhesion (2005-05-10),
10. 6864168 - Bump and fabricating process thereof (2005-03-08),
11. 6819002 - Under-ball-metallurgy layer (2004-11-16),

Title: Innovations of Chih-Huang Chang in Semiconductor Technology

Introduction

Chih-Huang Chang is a prominent inventor based in Tainan Hsien, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 11 patents. His work focuses on innovative manufacturing methods and structures that enhance the performance and efficiency of semiconductor devices.

Latest Patents

Among his latest patents is a semiconductor chip package manufacturing method and structure. This invention provides a comprehensive method for creating a semiconductor chip package that includes an image sensor chip and an encapsulant. The process involves several steps, such as placing a transparent insulator on the active area of the chip, forming an insulation layer, and creating a metal layer that extends the pads to the lower surface of the base. Another notable patent is for a leadframe of a leadless flip-chip package. This invention features a design that includes inner leads, a nonconductive ink layer, and a solder mask layer, which collectively enhance the reliability and functionality of the package.

Career Highlights

Chih-Huang Chang is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate in semiconductor packaging technologies. His expertise and dedication to research have positioned him as a key figure in the industry.

Collaborations

He has collaborated with notable coworkers, including William Tze-You Chen and Ho-Ming Tong, contributing to various projects that advance semiconductor technology.

Conclusion

Chih-Huang Chang's contributions to semiconductor technology through his patents and career at Advanced Semiconductor Engineering, Inc. highlight his role as an influential inventor in the field. His innovative methods and structures continue to shape the future of semiconductor manufacturing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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