The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 2006
Filed:
Sep. 23, 2004
Ying-tsai Yeh, Kaohsiung, TW;
Chih-huang Chang, Yongkang, TW;
Yung LI LU, Kaohsiung, TW;
Advanced Semiconductor Engineering, Inc., Kaoshiung, TW;
Abstract
A chip on glass package. A glass substrate has a top surface and a corresponding bottom surface. A plurality of chips are flip-chip mounted on the top surface of the glass substrate. The bottom surface of the glass substrate is secured to and electrically connected with a carrier. An encapsulation material is formed around the glass substrate to seal the chips. The encapsulation material has a cavity to expose the contact area of the top surface of the glass substrate. Therefore the chip on glass package is to possess a better protection and electrical connection of the glass substrate.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile