Yung Li Lu

Title: Yung Li Lu: Innovator in Chip Packaging Technology

Introduction

Yung Li Lu is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor packaging, particularly with his innovative designs that enhance the performance and reliability of electronic components. His work is characterized by a focus on improving electrical connections and protection for semiconductor devices.

Latest Patents

Yung Li Lu holds a patent for a "Chip on Glass Package." This invention involves a glass substrate with a top surface and a corresponding bottom surface. A plurality of chips are flip-chip mounted on the top surface of the glass substrate. The bottom surface of the glass substrate is secured to and electrically connected with a carrier. An encapsulation material is formed around the glass substrate to seal the chips. This encapsulation material features a cavity that exposes the contact area of the top surface of the glass substrate. As a result, the chip on glass package offers improved protection and electrical connection for the glass substrate.

Career Highlights

Yung Li Lu is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to develop innovative packaging solutions for semiconductor devices. His work has been instrumental in advancing the technology used in the semiconductor industry.

Collaborations

Yung Li Lu has collaborated with notable colleagues, including Ying-Tsai Yeh and Chih-Huang Chang. These partnerships have contributed to the successful development of various semiconductor technologies.

Conclusion

Yung Li Lu is a key figure in the semiconductor industry, known for his innovative chip packaging solutions. His contributions, particularly the chip on glass package, demonstrate his commitment to enhancing the performance and reliability of electronic components. His work continues to influence the future of semiconductor technology.