The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2005
Filed:
Aug. 18, 2003
William Tze-you Chen, Endicott, NY (US);
Ho-ming Tong, Taipei, TW;
Chun-chi Lee, Kaohsiung, TW;
Su Tao, Kaohsiung, TW;
Chih-huang Chang, Tainan Hsien, TW;
Jeng-da Wu, Kaohsiung Hsien, TW;
Wen-pin Huang, Tainan, TW;
Po-jen Cheng, Kaohsiung, TW;
William Tze-You Chen, Endicott, NY (US);
Ho-Ming Tong, Taipei, TW;
Chun-Chi Lee, Kaohsiung, TW;
Su Tao, Kaohsiung, TW;
Chih-Huang Chang, Tainan Hsien, TW;
Jeng-Da Wu, Kaohsiung Hsien, TW;
Wen-Pin Huang, Tainan, TW;
Po-Jen Cheng, Kaohsiung, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
A bump structure on a contact pad and a fabricating process thereof. The bump comprises an under-ball-metallurgy layer, a bonding mass and a welding lump. The under-ball-metallurgy layer is formed over the contact pad and the bonding mass is formed over the under-ball-metallurgy layer by conducting a pressure bonding process. The bonding mass having a thickness between 4 to 10 μm is made from a material such as copper. The welding lump is formed over the bonding mass such that a sidewall of the bonding mass is also enclosed.