Wen-Pin Huang

Title: Innovations by Wen-Pin Huang

Introduction

Wen-Pin Huang is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 9 patents. His work focuses on enhancing the efficiency and functionality of semiconductor devices.

Latest Patents

Among his latest patents are two innovative inventions. The first is a "Wafer supporting mechanism and method for wafer dicing." This invention provides a wafer supporting mechanism that includes a base portion with a first gas channel and a support portion connected to it. The design defines an accommodation space that enhances the wafer dicing process. The second patent is for a "Semiconductor device package and method of manufacturing the same." This invention describes a semiconductor device package that includes a substrate, electronic components, and a protective shield, optimizing the assembly and functionality of semiconductor devices.

Career Highlights

Wen-Pin Huang is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate in semiconductor technology. His work has been instrumental in advancing the capabilities of semiconductor devices, making them more efficient and reliable.

Collaborations

Wen-Pin has collaborated with several talented individuals in his field, including Li-Hua Tai and Sung-Ching Hung. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Wen-Pin Huang's contributions to semiconductor technology through his patents and collaborations highlight his role as a leading inventor in the industry. His work continues to influence the future of semiconductor devices and their applications.