Hsinchu, Taiwan

Chih-Cheng Hsu

This inventor holds 5 USPTO granted patents and 2 EPO patents. Top assignee: Kingpak Technology Inc.. Active years: 2012-2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chih-Cheng Hsu. Retrieved from https://idiyas.com/inventor/chih-cheng-hsu-t3elo6gc

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 80.0

 

Average Co-Inventor Count = 8.0

ph-index = 3

Forward Citations = 12(Granted Patents)


Location History:

  • Chu-Pei, TW (2012 - 2014)
  • Hsin-Chu Hsien, TW (2013 - 2014)

Company Filing History:


Years Active: 2012-2014

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5 patents (USPTO):Explore Patents

Title: Chih-Cheng Hsu: Innovator in Image Sensor Technology

Introduction

Chih-Cheng Hsu is a prominent inventor based in Hsin-Chu Hsien, Taiwan. He has made significant contributions to the field of image sensor technology, holding a total of 5 patents. His innovative work focuses on enhancing the reliability and efficiency of image sensor packaging structures.

Latest Patents

One of his latest patents is titled "Image sensor package structure with casing including a vent without sealing and in communication with package material." This invention discloses an image sensor package structure that includes a substrate, a chip, a transparent lid, a first casing, and a package material. The transparent lid covers the sensitization area of the chip and adheres to it, which is positioned on the substrate. The first casing adheres to the transparent lid and forms an opening that allows light to pass through, enhancing the sensor's functionality. The arrangement of adhesive layers between the first casing and the transparent lid, as well as between the transparent lid and the chip, elongates the blockage area from moisture, thereby improving the reliability of the image sensor package structure.

Another notable patent is "Wafer level image sensor packaging structure and manufacturing method of the same." This invention outlines a straightforward and cost-effective manufacturing method for wafer-level image sensor packaging. The process includes providing a silicon wafer, dicing it, and fabricating a plurality of semi-finished products. The encapsulant is strategically arranged on the lateral sides of the semi-finished products to prevent the image sensor chip from cracking during handling. This method results in a lightweight, thin, and compact packaging structure.

Career Highlights

Chih-Cheng Hsu is currently associated with Kingpak Technology Inc., where he continues to innovate in the field of image sensors. His work has significantly impacted the industry, leading to advancements in sensor reliability and manufacturing efficiency.

Collaborations

He has collaborated with notable coworkers, including Hsiu-Wen Tu and Ren-Long Kuo, contributing to various projects that enhance the capabilities of image sensor technologies.

Conclusion

Chih-Cheng Hsu's contributions to image sensor technology through his patents and work at Kingpak Technology Inc. highlight his role as a key innovator in the field. His inventions not only improve the reliability of image sensors but also streamline manufacturing processes,

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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