The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2013
Filed:
Jan. 21, 2011
Hsiu-wen Tu, Hsin-Chu Hsien, TW;
Chung-hsien Hsin, Hsin-Chu Hsien, TW;
Han-hsing Chen, Hsin-Chu Hsien, TW;
Ming-hui Chen, Hsin-Chu Hsien, TW;
Ren-long Kuo, Hsin-Chu Hsien, TW;
Chih-cheng Hsu, Hsin-Chu Hsien, TW;
Young-houng Shiao, Hsin-Chu Hsien, TW;
Tsao-pin Chen, Hsin-Chu Hsien, TW;
Hsiu-Wen Tu, Hsin-Chu Hsien, TW;
Chung-Hsien Hsin, Hsin-Chu Hsien, TW;
Han-Hsing Chen, Hsin-Chu Hsien, TW;
Ming-Hui Chen, Hsin-Chu Hsien, TW;
Ren-Long Kuo, Hsin-Chu Hsien, TW;
Chih-Cheng Hsu, Hsin-Chu Hsien, TW;
Young-Houng Shiao, Hsin-Chu Hsien, TW;
Tsao-Pin Chen, Hsin-Chu Hsien, TW;
Kingpak Technology Inc., Hsin-Chu Hsien, TW;
Abstract
The present invention discloses a manufacturing method and structure of a wafer level image sensor module with package structure. The structure of the wafer level image sensor module with package structure includes a semi-finished product, a plurality of solder balls, and an encapsulant. The semi-finished product includes an image sensing chip and a wafer level lens assembly. The encapsulant is disposed on lateral sides of the image sensing chip and the wafer level lens assembly. Also, the manufacturing method includes the steps of: providing a silicon wafer, dicing the silicon wafer, providing a lens assembly wafer, fabricating a plurality of semi-finished products, performing a packaging process, mounting the solder balls, and cutting the encapsulant. Accordingly, the encapsulant encapsulates each of the semi-finished products by being disposed on the lateral sides thereof.