Hsin-Chu Hsien, Taiwan

Ming-Hui Chen


 

Average Co-Inventor Count = 4.6

ph-index = 3

Forward Citations = 16(Granted Patents)


Location History:

  • Hsin-Chu Hsien, TW (2013 - 2014)
  • Hsin-Chu County, TW (2018)

Company Filing History:


Years Active: 2013-2018

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5 patents (USPTO):Explore Patents

Title: Innovations of Inventor Ming-Hui Chen

Introduction

Ming-Hui Chen is a prominent inventor based in Hsin-Chu Hsien, Taiwan. He has made significant contributions to the field of sensor technology and packaging structures. With a total of 5 patents to his name, Chen continues to push the boundaries of innovation in his industry.

Latest Patents

One of his latest patents is a sensor package structure that includes a substrate, a sensing member, a shielding member, a metallic wire, and an encapsulating compound. The substrate features a die bonding zone and a wiring zone. The sensing member is mounted on the die bonding zone and consists of a sensing zone, a carrying zone arranged around the sensing zone, and a connecting zone located outside of the carrying zone. The shielding member includes a translucent covering portion and a supporting portion connected to the peripheral portion of the covering portion. The supporting portion, which has a coefficient of thermal expansion less than 10 ppm/°C, is fixed on the carrying zone. The metallic wire connects the wiring zone and the connecting zone, while the encapsulating compound is disposed on the wiring zone and covers the peripheral side of the sensing member, the connecting zone, and the peripheral side of the shielding member.

Another notable patent is the wafer level image sensor packaging structure and its manufacturing method. This invention discloses a straightforward and cost-saving manufacturing process that includes providing a silicon wafer, dicing it, and fabricating a plurality of semi-finished products. The packaging process involves mounting solder balls and cutting an encapsulant between the semi-finished products. This method results in a lightweight, thin, and compact wafer level image sensor package structure. To prevent the image sensor chip from cracking during handling, the encapsulant is arranged on the lateral sides of the semi-finished products during the packaging process.

Career Highlights

Ming-Hui Chen is currently employed at Kingpak Technology Inc., where he continues to innovate and develop new technologies. His work has significantly impacted the field of sensor packaging, making it more efficient and reliable.

Collaborations

Some of his notable coworkers include Chung-Hsien Hsin and Hsiu-Wen Tu, who have collaborated with him on various projects.

Conclusion

Ming-Hui Chen is a distinguished inventor whose contributions to sensor technology and packaging structures have

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