The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2014
Filed:
Jan. 25, 2011
Hsiu-wen Tu, Hsin-Chu Hsien, TW;
Chung-hsien Hsin, Hsin-Chu Hsien, TW;
Han-hsing Chen, Hsin-Chu Hsien, TW;
Ming-hui Chen, Hsin-Chu Hsien, TW;
Ren-long Kuo, Hsin-Chu Hsien, TW;
Chih-cheng Hsu, Hsin-Chu Hsien, TW;
Young-houng Shiao, Hsin-Chu Hsien, TW;
Tsao-pin Chen, Hsin-Chu Hsien, TW;
Hsiu-Wen Tu, Hsin-Chu Hsien, TW;
Chung-Hsien Hsin, Hsin-Chu Hsien, TW;
Han-Hsing Chen, Hsin-Chu Hsien, TW;
Ming-Hui Chen, Hsin-Chu Hsien, TW;
Ren-Long Kuo, Hsin-Chu Hsien, TW;
Chih-Cheng Hsu, Hsin-Chu Hsien, TW;
Young-Houng Shiao, Hsin-Chu Hsien, TW;
Tsao-Pin Chen, Hsin-Chu Hsien, TW;
Kingpak Technology Inc., Hsin-Chu Hsien, TW;
Abstract
The present invention discloses a wafer level image sensor packaging structure and a manufacturing method of the same. The manufacturing method includes the following steps: providing a silicon wafer, dicing the silicon wafer, providing a plurality of transparent lids, fabricating a plurality of semi-finished products, performing a packaging process, mounting solder balls, and cutting an encapsulant between the semi-finished products. The manufacturing method of the invention has the advantage of being straightforward, uncomplicated, and cost-saving. Thus, the wafer level image sensor package structure is lightweight, thin, and compact. To prevent the image sensor chip from cracking on impact during handling, the encapsulant will be arranged on the lateral sides of the semi-finished products during the packaging process.