The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2012
Filed:
Oct. 22, 2009
Hsiu-wen Tu, Chu-Pei, TW;
Ren-long Kuo, Chu-Pei, TW;
Young-houng Shiao, Chu-Pei, TW;
Tsao-pin Chen, Chu-Pei, TW;
Mon-nan Ho, Chu-Pei, TW;
Chih-cheng Hsu, Chu-Pei, TW;
Chin-fu Lin, Chu-Pei, TW;
Chung-hsien Hsin, Chu-Pei, TW;
Hsiu-Wen Tu, Chu-Pei, TW;
Ren-Long Kuo, Chu-Pei, TW;
Young-Houng Shiao, Chu-Pei, TW;
Tsao-Pin Chen, Chu-Pei, TW;
Mon-Nan Ho, Chu-Pei, TW;
Chih-Cheng Hsu, Chu-Pei, TW;
Chin-Fu Lin, Chu-Pei, TW;
Chung-Hsien Hsin, Chu-Pei, TW;
Kingpak Technology, Inc., Hsin-Chu Hsien, TW;
Abstract
A manufacturing method for molding an image sensor package structure and the image sensor package structure thereof are disclosed. The manufacturing method includes following steps of providing a half-finished image sensor for packaging, arranging a dam on the peripheral of a transparent lid of the half-finished image sensor, positioning the half-finished image sensor within a mold, and injecting a mold compound into the mold cavity of the mold. The dam is arranged on the top surface of the transparent lid and the inner surface of the mold can exactly contact with the top surface of dam so that the mold compound injected into the mold cavity is prevented from overflowing to the transparent lid by the dam. Furthermore, the arrangement of the dam and the mold compound can increase packaged areas and extend blockage to invasive moisture so as to enhance the reliability of the image sensor package structure.