The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2013
Filed:
Jan. 07, 2010
Hsiu-wen Tu, Hsin-Chu Hsien, TW;
Ren-long Kuo, Hsin-Chu Hsien, TW;
Young-houng Shiao, Hsin-Chu Hsien, TW;
Tsao-pin Chen, Hsin-Chu Hsien, TW;
Mon-nam Ho, Hsin-Chu Hsien, TW;
Chih-cheng Hsu, Hsin-Chu Hsien, TW;
Chin-fu Lin, Hsin-Chu Hsien, TW;
Chung-hsien Hsin, Hsin-Chu Hsien, TW;
Hsiu-Wen Tu, Hsin-Chu Hsien, TW;
Ren-Long Kuo, Hsin-Chu Hsien, TW;
Young-Houng Shiao, Hsin-Chu Hsien, TW;
Tsao-Pin Chen, Hsin-Chu Hsien, TW;
Mon-Nam Ho, Hsin-Chu Hsien, TW;
Chih-Cheng Hsu, Hsin-Chu Hsien, TW;
Chin-Fu Lin, Hsin-Chu Hsien, TW;
Chung-Hsien Hsin, Hsin-Chu Hsien, TW;
Kingpak Technology Inc., Hsin-Chu Hsien, TW;
Abstract
The present invention discloses an image sensor package structure with a large air cavity. The image sensor package structure includes a substrate, a chip, a cover and a package material. The chip is combined with the substrate. A plastic sheet of the cover is adhered to the chip and a transparent lid of the cover is combined with the plastic sheet to provide a covering over a sensitization area of the chip so as to form an air cavity. The package material is arranged on the substrate and encapsulated around the chip and the cover. The plastic sheet having a predetermined thickness can increase the distance between the transparent lid and the chip to enlarge the air cavity. Thus, the image-sensing effect of the image sensor package structure can be improved and the ghost image problem resulting from multi-refraction and multi-reflection of light can be minimized.