The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2014
Filed:
Oct. 15, 2009
Hsiu-wen Tu, Chu-Pei, TW;
Ren-long Kuo, Chu-Pei, TW;
Young-houng Shiao, Chu-Pei, TW;
Tsao-pin Chen, Chu-Pei, TW;
Mon-nan Ho, Chu-Pei, TW;
Chih-cheng Hsu, Chu-Pei, TW;
Chin-fu Lin, Chu-Pei, TW;
Chung-hsien Hsin, Chu-Pei, TW;
Hsiu-Wen Tu, Chu-Pei, TW;
Ren-Long Kuo, Chu-Pei, TW;
Young-Houng Shiao, Chu-Pei, TW;
Tsao-Pin Chen, Chu-Pei, TW;
Mon-Nan Ho, Chu-Pei, TW;
Chih-Cheng Hsu, Chu-Pei, TW;
Chin-Fu Lin, Chu-Pei, TW;
Chung-Hsien Hsin, Chu-Pei, TW;
Kingpak Technology Inc., Hsin-Chu Hsien, TW;
Abstract
The present invention discloses an image sensor package structure. The image sensor package structure includes a substrate, a chip, a transparent lid, a first casing and a package material. The transparent lid covers a sensitization area of the chip and it also adheres to the chip which is deposed on the substrate. The first casing, which adheres to the transparent lid, forms an opening so that light can pass through the opening and the transparent lid to enter into the sensitization area. The package material covers around the chip and the transparent lid and fills between the substrate and the first casing. Because of the arrangement of adhesive layers placed between the first casing and the transparent lid and between the transparent lid and the chip, the blockage area from moisture is elongated. Therefore, the reliability of the image sensor package structure can be enhanced.