Taoyuan, Taiwan

Chia-Ta Chang


Average Co-Inventor Count = 3.1

ph-index = 3

Forward Citations = 14(Granted Patents)


Location History:

  • Tao Yuan Shien, TW (2019)
  • Tao Yuan, TW (2018 - 2024)

Company Filing History:


Years Active: 2018-2025

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12 patents (USPTO):Explore Patents

Title: The Innovations of Chia-Ta Chang

Introduction

Chia-Ta Chang is a prominent inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of electronics, holding a total of 12 patents. His work focuses on advanced electronic structures and devices, showcasing his expertise and innovative spirit.

Latest Patents

Among his latest patents is an electronic structure and method of manufacturing the same. This electronic structure includes a substrate, a plurality of conductors, a bump structure, and a protective layer. The conductors are strategically disposed on the substrate, while the bump structure is positioned on at least one of the conductors. Additionally, a protective layer is placed over the conductors, exposing a region between them. Another notable patent is for a surface acoustic wave (SAW) device. This device comprises a substrate, a finger portion of an interdigital transducer (IDT) electrode, and a pad portion that is electrically connected to the finger portion. The wiring electrode, which includes a contact metal layer and an aluminum-based layer, is also a critical component of this invention.

Career Highlights

Chia-Ta Chang is currently employed at Win Semiconductors Corp., where he continues to push the boundaries of electronic innovation. His work has not only advanced the technology but has also contributed to the growth of the semiconductor industry.

Collaborations

He collaborates with talented coworkers such as Chun-Ju Wei and Kuo-Lung Weng, further enhancing the innovative environment at Win Semiconductors Corp.

Conclusion

Chia-Ta Chang's contributions to electronics through his patents and collaborations highlight his role as a leading inventor in the field. His innovative work continues to shape the future of electronic devices and structures.

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