The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2025
Filed:
May. 26, 2022
Applicant:
Win Semiconductors Corp., Taoyuan, TW;
Inventors:
Chia-Ta Chang, Taoyuan, TW;
Po-Wei Ting, Taoyuan, TW;
Assignee:
WIN SEMICONDUCTORS CORP., Taoyuan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/02 (2006.01); H01L 23/00 (2006.01); H03H 3/08 (2006.01); H03H 9/05 (2006.01); H03H 9/10 (2006.01);
U.S. Cl.
CPC ...
H03H 9/02992 (2013.01); H01L 24/11 (2013.01); H03H 9/02984 (2013.01); H03H 9/059 (2013.01); H01L 2224/11849 (2013.01);
Abstract
An electronic structure is provided. The electronic structure includes a substrate, a plurality of conductors, a bump structure, and a protective layer. The conductors are disposed on the substrate. The bump structure is disposed on at least one of the conductors. The protective layer is disposed on the conductors. A region is exposed between the conductors. A method of manufacturing the electronic structure is also provided.