The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2025
Filed:
Jan. 03, 2023
Applicant:
Win Semiconductors Corp., Taoyuan, TW;
Inventors:
Cheng-Yao Lai, Taoyuan, TW;
Chia-Ta Chang, Taoyuan, TW;
Meng-Tse Hsu, Taoyuan, TW;
Ya-Chu Yang, Taoyuan, TW;
Assignee:
WIN SEMICONDUCTORS CORP., Taoyuan, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03H 9/02 (2006.01); H03H 9/05 (2006.01); H03H 9/145 (2006.01); H03H 9/25 (2006.01);
U.S. Cl.
CPC ...
H03H 9/02661 (2013.01); H03H 9/059 (2013.01); H03H 9/14502 (2013.01); H03H 9/14541 (2013.01); H03H 9/25 (2013.01);
Abstract
A surface acoustic wave (SAW) device includes: a substrate; a finger portion of an interdigital transducer (IDT) electrode disposed on the substrate; a pad portion of the interdigital transducer electrode electrically connected to the finger portion; and a wiring electrode disposed on the pad portion. The wiring electrode includes a contact metal layer and an aluminum-based layer. The contact metal layer is disposed between the pad portion and the aluminum-based layer. The contact metal layer includes platinum, palladium, or gold.